Kupros, Inc. develops Cu29, the first all-metal, high-conductivity 3D printing filament designed for embedded electronics manufacturing using standard FDM/FFF printers. Cu29 enables engineers to print functional circuits, antennas, sensors, and shielding directly into polymer and structural parts, without post-processing, circuit boards, or wiring. With over 48,000% greater conductivity than competing FDM filaments and a solderable, low and high volta formula, Cu29 is used across aerospace, defense, and CubeSat applications. The material works with desktop printers under $500 and industrial printers up to $250k, making it ideal for distributed manufacturing, prototyping, and mission-critical electronics. Kupros has secured contracts with NASA, Northrop Grumman, the US Army, KBR, Boeing, and more, and is actively developing new Cu29 variants for aerospace, anti-tamper, high-temperature, and radiation-hardened use cases. Founded out of the NSIN Foundry and headquartered near NSWC Crane, Kupros is building the foundation of the next-generation embedded electronics stack.